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Current StatusNameTool IdCategoryWarning/Down message
WarningVertical Furnace - LPCVD (Si3N4, SiNx)PD09Thermal processVacuum pump levels need to be checked before running. Contact MSL prior to run.
WarningSputter - magnetron "Von Ardenne"PT01Thin film depositionUpdate: The TC_pump has been disconnected from the computer and is controlled separately. This ensures a continuous operation of the TC_pump. It looks on the screen as if the pump is not running but it is just being operated from the external controller. However, users can run any program as normally. We are working on restoring the control to the computer. For unknown reasons, the TC_pumps has stopped several times. If this happens, right-click and stop the pump and then right-click and start it again. Also send a message with the details. We are working on this error.
WarningSpin-Rinse-DryerPC41Wet process & preparationUpper chamber, for 4" wafers, does not rinse properly due to low water flow. Lower chamber works just fine.
WarningNanoindenterAU06Surface analysisCurrently unavailable (Quick Z-approach does not work) - under maintenance!
WarningCZTS sputterPT20Thin film depositionFluctuations in cooling water supply sensors. Your recipes may fail because insufficient water supply to power supply triggers interlocks. CZTS recipes can still be run if you do not see any fluctuations in cooling water sensors.
WarningSpectroscopic ellipsometerPM33MetrologyOn ALD tool.
WarningICP-RIE (Si-DRIE / aluminum etch)PE01Dry etchLeft chamber operational. (Never mind all tools scattered around.) Transfer problems to right chamber. Currently pressure in right chamber is off by 5 mTorr, recipes therefore need to change by increase the set point by +5 mTorr.
DownBench-top Vacuum OvenPC46Wet process & preparation 
DownE-beam/resisitive evaporator - BAPT14Thin film depositionBA is down due to water leak in the chamber. /Amit
AvailableFume Hood - CBDPC48Wet process & preparation 
AvailableALD - F120PT15Thin film deposition 
AvailableTube Furnace - pipe 1PD19Thermal process 
AvailableSulfoselenisation Furnace (SuSe)PD20Thermal process 
AvailableSputter - magnetron ZnO/CZTSPT16Thin film deposition 
AvailableLaminatorPB15Backend process 
AvailableUltrasonic HomogenizerPC50Wet process & preparation 
AvailableImage Reversal / Vapor Prime FurnacePL36Lithography 
AvailableALDPT17Thin film deposition 
AvailableSEM/EDS/EBSD - MerlinAS05Scanning electron Microscopy (SEM) 
AvailableVacuum Leak TesterPO01Other processes 
AvailableFume hood – solventsFC06Wet process & preparation 
AvailableFume hood – acidsFC09Wet process & preparation 
AvailableElectron Beam Lithograph EBLPL37Lithography 
AvailableResist spinnerPL38Lithography 
AvailableSpectroscopic reflectometer "K-MAC"PM31Metrology 
AvailableIon Polisher IlionAP34Sample preparation 
AvailableStylus Profiler "DektakXT"PM32Metrology 
AvailableVacuum storage (large)PO03Other processes 
AvailableVacuum storage (small)PO04Other processes 
AvailableALD - MP3PT19Thin film deposition 
AvailableResist LaminatorPB16Backend process 
AvailableWet Bench - solvent cleaningPL27Lithography 
AvailableSEM/EDS - 1530AS06Scanning electron Microscopy (SEM) 
AvailableDiamond polishingAT17Transmission electron microscopy (TEM) 
AvailableFume Hood – KCNPC51Wet process & preparation 
AvailableGlass substrate cleanerPC52Wet process & preparation 
AvailableTEM/EDS - TitanAT18Transmission electron microscopy (TEM) 
AvailableESCA IIAX02Chemical analysis 
AvailableSulfoselenisation RTP (Bettan)PD21Thermal process 
AvailableIon Beam EtcherPE10Dry etch 
AvailableALD - inSEPT21Thin film deposition 
AvailableOptical Profiler - ZYGOAU07Surface analysis 
AvailableOptical microscopePL39Lithography 
AvailableIon Beam EtcherPE11Dry etch 
AvailableLaser cutterPB17Backend process 
AvailableTCO sputterPT18Thin film deposition 
AvailableXRFAX03Chemical analysis 
AvailableGDOESAX04Chemical analysis 
AvailableFour Point Probe - automaticPM21Metrology 
AvailableVertical Furnace (high temp anneal)PD05Thermal process 
AvailableDicing SawPB01Backend process 
AvailableWire Bonder - ballPB02Backend process 
AvailableWire Bonder - wedgePB03Backend process 
AvailableE-Beam evaporator - FlutterPT06Thin film deposition 
AvailableEvaporator - TMP (general use)PT07Thin film deposition 
AvailableEvaporator - cryo (restricted use)PT08Thin film deposition 
AvailablePhotomask ProcessorPL33Lithography 
AvailableStylus Profiler "Dektak 150"PM22Metrology 
AvailableICP-RIE (Si-DRIE) "Tegal"PE07Dry etch 
AvailablePick-&-Place (w. dispenser)PB06Backend process 
AvailableScreen PrinterPB07Backend process 
AvailableHydraulic Press (w. heater)PB08Backend process 
AvailableSolder FurnacePB09Backend process 
AvailableResist LaminatorPB10Backend process 
AvailableUV ExposurePB11Backend process 
AvailableResist FurnacePB12Backend process 
AvailableInk Jet PrinterPB13Backend process 
AvailableDip CoaterPC44Wet process & preparation 
AvailableSpray EtcherPC45Wet process & preparation 
AvailableParylene CoaterPD16Thermal process 
AvailableHT Furnace - atmPD17Thermal process 
AvailablePlasma EtcherPE08Dry etch 
AvailableMeasuring Microscope with Digital ReadoutPM24Metrology 
AvailableStereo MicroscopePM25Metrology 
AvailableX-Ray Inspection StationPM26Metrology 
AvailableMeasurement StationPM27Metrology 
AvailableResist Furnace (90 C)PL15Lithography 
AvailableOptical Microscope (mask insp.)PL35Lithography 
AvailableUltrasonic CleanerAP33Sample preparation 
AvailableFurnaceAT15Transmission electron microscopy (TEM) 
AvailablePolisherAT16Transmission electron microscopy (TEM) 
AvailableOptical Microscope - Reichert invertedAU05Surface analysis 
AvailableOptical MicroscopePM30Metrology 
AvailableSputter - magnetron "Lesker"PT09Thin film deposition 
AvailableEvaporator "Edwards"PT02Thin film deposition 
AvailablePECVDPT04Thin film deposition 
AvailableOptical MicroscopePM01Metrology 
AvailableOptical MicroscopePM02Metrology 
AvailableOptical MicroscopePM03Metrology 
AvailableOptical MicroscopePM04Metrology 
AvailableOptical MicroscopePM05Metrology 
AvailableStress MeterPM10Metrology 
AvailableEllipsometer "Rudolph"PM12Metrology 
AvailableOptical MicroscopePM17Metrology 
AvailableIR cameraPM18Metrology 
AvailableSaw - low speedAP01Sample preparation 
AvailableSawAP02Sample preparation 
AvailableEmbedderAP03Sample preparation 
AvailableWet GrinderAP04Sample preparation 
AvailableWet GrinderAP05Sample preparation 
AvailablePolisherAP06Sample preparation 
AvailablePolisherAP07Sample preparation 
AvailableSputter Coater - Au/PdAP16Sample preparation 
AvailableEvaporator (C)AP17Sample preparation 
AvailableUltrasonic CleanerAP28Sample preparation 
AvailableHot PlateAP31Sample preparation 
AvailableBalanceAP32Sample preparation 
AvailableOptical Microscope - OlympusAU03Surface analysis 
AvailableAFM - PSIA XE150AU04Surface analysis 
AvailableSEM/EDS - 1550AS02Scanning electron Microscopy (SEM) 
AvailableUltrasonic Disc CutterAT04Transmission electron microscopy (TEM) 
AvailablePolisherAT05Transmission electron microscopy (TEM) 
AvailableDimple GrinderAT06Transmission electron microscopy (TEM) 
AvailableDimple GrinderAT07Transmission electron microscopy (TEM) 
AvailableIon Mill PIPSAT08Transmission electron microscopy (TEM) 
AvailablePlasma CleanerAT09Transmission electron microscopy (TEM) 
AvailableOptical MicroscopeAT10Transmission electron microscopy (TEM) 
AvailableOptical MicroscopeAT11Transmission electron microscopy (TEM) 
AvailableUltrasonic CleanerAT12Transmission electron microscopy (TEM) 
AvailableHot PlateAT13Transmission electron microscopy (TEM) 
AvailableEx-situ ManipulatorAT14Transmission electron microscopy (TEM) 
AvailableFIB/SEM - DB235 CryoAF01Focused ion beam (FIB) 
AvailablePattern GeneratorPL32Lithography 
AvailableVertical Furnace - LPCVD (TEOS oxide)PD10Thermal process 
AvailableRTPPD15Thermal process 
AvailableMask Aligner - front / back side alignPL03Lithography 
AvailableSpin CoaterPL08Lithography 
AvailableSpin CoaterPL09Lithography 
AvailableSpin CoaterPL10Lithography 
AvailableHot PlatePL11Lithography 
AvailableHot PlatePL12Lithography 
AvailableHot PlatePL13Lithography 
AvailableVac. / Vap. Prime FurnacePL14Lithography 
AvailableResist FurnacePL18Lithography 
AvailableWet Bench / E-beam resist spinnerPL20Lithography 
AvailableWet Bench / E-beam resist hot-platePL21Lithography 
AvailableWet Bench / E-beam resist developmentPL22Lithography 
AvailableWet Bench - acidPL23Lithography 
AvailableWet Bench - acidPL24Lithography 
AvailableWet Bench - work deskPL25Lithography 
AvailableWet Bench - Water rinsePL26Lithography 
AvailableMask Aligner - front side alignPL04Lithography 
AvailableResist Furnace (110 C)PL16Lithography 
AvailableCAD / conversion workstationPL29Lithography 
AvailableSpin-Spray CoaterPL31Lithography 
AvailableWet Bench Etch and stripPC01Wet process & preparation 
AvailableWet Bench Acid surface treatmentsPC02Wet process & preparation 
AvailableWet Bench (RCA1 / RCA2 / HF)PC03Wet process & preparation 
AvailableWet Bench (RCA1 / RCA2 / HF)PC04Wet process & preparation 
AvailableWet Bench Solvent cleanPC05Wet process & preparation 
AvailableWet Bench Resist lift-offPC06Wet process & preparation 
AvailableWet Bench Oxide etchingPC07Wet process & preparation 
AvailableWet Bench 7-upPC08Wet process & preparation 
AvailableWet Bench Metal etchingPC09Wet process & preparation 
AvailableWet Bench - Megasonic cleaningPC10Wet process & preparation 
AvailableWet Bench - Ultrasonic cleaningPC11Wet process & preparation 
AvailablePC12 - wet bench - StanglPC12Wet process & preparation 
AvailableWet bench (RCA1 / RCA2 / HF)PC14Wet process & preparation 
AvailableWet Bench - free acid / acid drain (KOH)PC18Wet process & preparation 
AvailableWet Bench (KOH / HF)PC19Wet process & preparation 
AvailableWet Bench (KOH-IPA / HF / warm rinse)PC20Wet process & preparation 
AvailableWet Bench - high temp acidPC21Wet process & preparation 
AvailableWet Bench - heating bath acidPC22Wet process & preparation 
AvailableWet Bench - high temp acidPC23Wet process & preparation 
AvailableWet Bench - heating bathPC24Wet process & preparation 
AvailableWet Bench (acetone)PC25Wet process & preparation 
AvailableWet Bench - heating bathPC26Wet process & preparation 
AvailableWet Bench - hot platePC27Wet process & preparation 
AvailableVertical Furnace (oxidation)PD01Thermal process 
AvailableVertical Furnace (oxidation)PD02Thermal process 
AvailableVertical Furnace (general purpose)PD03Thermal process 
AvailableVertical Furnace (metal anneal)PD07Thermal process 
AvailableVertical Furnace - LPCVD (poly-Si, a-Si)PD08Thermal process 
AvailableCIGS evaporator - BAKPT10Thin film deposition 
AvailableEvaporator - UMSPT11Thin film deposition 
AvailableCIGS evaporator - M. PilotePT12Thin film deposition 
AvailableSpin-Rinse-DryerPC47Wet process & preparation 
AvailableMo sputter - MRC IIPT13Thin film deposition 
AvailableScriberPB14Backend process 
AvailablePCB plotterPB18Backend process 
AvailablePL / EL Quantum YieldPM34Metrology 
AvailableFIB/SEM - CrossbeamAF02Focused ion beam (FIB) 
AvailableSputter - table-topPT22Thin film deposition 
AvailableFour Point ProbePM35Metrology 
AvailablePlasmastripper "New Lower"PE12Dry etch 
AvailablePlasmastripper "Upper"PE04Dry etch 
AvailableRIE (SiO / SiN)PE06Dry etch 
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