| Warning | Evaporator - TMP (general use) | PT07 | Thin film deposition | Pocket 2 contaminated by Cu |
| Warning | Wet Bench (KOH / HF) | PC19 | Wet process & preparation | Bath B is out of function due to a leak. |
| Warning | RTP | PD15 | Thermal process | No process above 500C is allowed. |
| Warning | Optical Microscope | PM17 | Metrology | The scale is incorrect (for all objectives). Not possible to do measurments. |
| Warning | RIE (SiO / SiN) | PE06 | Dry etch | Equipment repaired. Due to hardware modification, all recipes have to be tested and evaluated. |
| Warning | ICP-RIE (Si-DRIE / aluminum etch) | PE01 | Dry etch | Right side in 100 mm configuration. |
| Warning | Beamer computer | PL41 | Lithography | L-Edit CAD software not available due to licensing and server problems |
| Down | Plasmastripper "Upper" | PE04 | Dry etch | Can only be run in manual mode. See instruction at machine. Only as spare, should PE12 die. |
| Down | SEM/EDS - 1550 | AS02 | Scanning electron Microscopy (SEM) | Electron gun error, service contacted. |
| Down | Vertical Furnace - LPCVD (TEOS oxide) | PD10 | Thermal process | Pumps on poly-Si PD08.
Vacuum pump oil levels need to be checked before every run. Contact MSL prior to run. |
| Available | Ultrasonic Disc Cutter | AT04 | Transmission electron microscopy (TEM) | |
| Available | Polisher | AT05 | Transmission electron microscopy (TEM) | |
| Available | Dimple Grinder | AT07 | Transmission electron microscopy (TEM) | |
| Available | Ion Mill PIPS | AT08 | Transmission electron microscopy (TEM) | |
| Available | Plasma Cleaner | AT09 | Transmission electron microscopy (TEM) | |
| Available | Ultrasonic Cleaner | AT12 | Transmission electron microscopy (TEM) | |
| Available | Hot Plate | AT13 | Transmission electron microscopy (TEM) | |
| Available | Four Point Probe - automatic | PM21 | Metrology | |
| Available | Vertical Furnace (high temp anneal) | PD05 | Thermal process | |
| Available | Dicing Saw | PB01 | Backend process | |
| Available | Wire Bonder - ball | PB02 | Backend process | |
| Available | Wire Bonder - wedge | PB03 | Backend process | |
| Available | Penta head 3D printer | PA02 | Additive manufacturing | |
| Available | Sputter - magnetron "Von Ardenne" | PT01 | Thin film deposition | |
| Available | Optical Microscope | PM01 | Metrology | |
| Available | Optical Microscope | PM02 | Metrology | |
| Available | Optical Microscope | PM03 | Metrology | |
| Available | Ellipsometer "Rudolph" | PM12 | Metrology | |
| Available | Wire Bonder - ball | PB19 | Backend process | |
| Available | IR camera | PM18 | Metrology | |
| Available | Balance | PM19 | Metrology | |
| Available | Balance | PM20 | Metrology | |
| Available | Saw - low speed | AP01 | Sample preparation | |
| Available | Saw | AP02 | Sample preparation | |
| Available | Embedder | AP03 | Sample preparation | |
| Available | Wet Grinder | AP05 | Sample preparation | |
| Available | Polisher | AP06 | Sample preparation | |
| Available | Polisher | AP07 | Sample preparation | |
| Available | Sputter Coater - Au/Pd | AP16 | Sample preparation | |
| Available | Evaporator (C) | AP17 | Sample preparation | |
| Available | Ultrasonic Cleaner | AP28 | Sample preparation | |
| Available | Hot Plate | AP31 | Sample preparation | |
| Available | Balance | AP32 | Sample preparation | |
| Available | LOM - Olympus - Optical Microscope | AU03 | Surface analysis | |
| Available | AFM - PSIA XE150 | AU04 | Surface analysis | |
| Available | Mask Aligner - front / back side align | PL03 | Lithography | |
| Available | Spin Coater | PL08 | Lithography | |
| Available | Spin Coater | PL10 | Lithography | |
| Available | Hot Plate | PL11 | Lithography | |
| Available | Hot Plate | PL12 | Lithography | |
| Available | Hot Plate | PL13 | Lithography | |
| Available | Vac. / Vap. Prime Furnace | PL14 | Lithography | |
| Available | Resist Furnace | PL18 | Lithography | |
| Available | Wet Bench / E-beam resist spinner | PL20 | Lithography | |
| Available | Wet Bench / E-beam resist hot-plate | PL21 | Lithography | |
| Available | Wet Bench / E-beam resist development | PL22 | Lithography | |
| Available | Wet Bench - acid | PL23 | Lithography | |
| Available | Wet Bench - acid | PL24 | Lithography | |
| Available | Wet Bench - work desk | PL25 | Lithography | |
| Available | Wet Bench - Water rinse | PL26 | Lithography | |
| Available | Mask Aligner - front side align | PL04 | Lithography | |
| Available | Resist Furnace (110 C) | PL16 | Lithography | |
| Available | Nanoimprinter | PL30 | Lithography | |
| Available | Spin-Spray Coater | PL31 | Lithography | |
| Available | Wet Bench (KOH-IPA / HF / warm rinse) | PC20 | Wet process & preparation | |
| Available | Wet Bench - acid drain, spin dryer | PC22 | Wet process & preparation | |
| Available | Vertical Furnace (oxidation) | PD01 | Thermal process | |
| Available | Vertical Furnace (oxidation) | PD02 | Thermal process | |
| Available | Vertical Furnace (general purpose) | PD03 | Thermal process | |
| Available | Vertical Furnace (metal anneal) | PD07 | Thermal process | |
| Available | Vertical Furnace - LPCVD (poly-Si, a-Si) | PD08 | Thermal process | |
| Available | Vertical Furnace - LPCVD (Si3N4, SiNx) | PD09 | Thermal process | |
| Available | Wet Bench Etch and strip | PC01 | Wet process & preparation | |
| Available | Wet Bench Acid surface treatments | PC02 | Wet process & preparation | |
| Available | Wet Bench (RCA1 / RCA2 / HF) | PC03 | Wet process & preparation | |
| Available | Wet Bench (RCA1 / RCA2 / HF) | PC04 | Wet process & preparation | |
| Available | Wet Bench Solvent clean | PC05 | Wet process & preparation | |
| Available | Wet Bench Resist lift-off | PC06 | Wet process & preparation | |
| Available | Wet Bench Oxide etching | PC07 | Wet process & preparation | |
| Available | Wet Bench Piranha | PC08 | Wet process & preparation | |
| Available | Wet Bench Metal etching | PC09 | Wet process & preparation | |
| Available | Wet Bench - Megasonic cleaning | PC10 | Wet process & preparation | |
| Available | Wet Bench - Ultrasonic cleaning | PC11 | Wet process & preparation | |
| Available | PC12 - wet bench - Stangl | PC12 | Wet process & preparation | |
| Available | Wet Bench - free acid / acid drain (KOH) | PC18 | Wet process & preparation | |
| Available | Evaporator - cryo (restricted use) | PT08 | Thin film deposition | |
| Available | Plating Station - pulse (Cu) | PC42 | Wet process & preparation | |
| Available | Stylus Profiler "Dektak 150" | PM22 | Metrology | |
| Available | ICP-RIE (Si-DRIE) "Tegal" | PE07 | Dry etch | |
| Available | Pick-&-Place (w. dispenser) | PB06 | Backend process | |
| Available | Screen Printer | PB07 | Backend process | |
| Available | Hydraulic Press (w. heater) | PB08 | Backend process | |
| Available | Solder Furnace | PB09 | Backend process | |
| Available | Resist Laminator | PB10 | Backend process | |
| Available | UV Exposure | PB11 | Backend process | |
| Available | Resist Furnace | PB12 | Backend process | |
| Available | Ink Jet Printer | PB13 | Backend process | |
| Available | Dip Coater | PC44 | Wet process & preparation | |
| Available | Spray Etcher | PC45 | Wet process & preparation | |
| Available | Parylene Coater | PD16 | Thermal process | |
| Available | HT Furnace - atm | PD17 | Thermal process | |
| Available | Plasma Etcher | PE08 | Dry etch | |
| Available | Measuring Microscope with Digital Readout | PM24 | Metrology | |
| Available | Stereo Microscope | PM25 | Metrology | |
| Available | X-Ray Inspection Station | PM26 | Metrology | |
| Available | Resist Furnace (90 C) | PL15 | Lithography | |
| Available | Optical Microscope | PL35 | Metrology | |
| Available | Ultrasonic Cleaner | AP33 | Sample preparation | |
| Available | Furnace | AT15 | Transmission electron microscopy (TEM) | |
| Available | Polisher | AT16 | Transmission electron microscopy (TEM) | |
| Available | Sputter - magnetron "Lesker" | PT09 | Thin film deposition | |
| Available | CIGS evaporator - BAK | PT10 | Thin film deposition | |
| Available | Evaporator - UMS | PT11 | Thin film deposition | |
| Available | Spin-Rinse-Dryer | PC47 | Wet process & preparation | |
| Available | Mo sputter - MRC II | PT13 | Thin film deposition | |
| Available | Scriber | PB14 | Backend process | |
| Available | E-beam/resisitive evaporator - BA | PT14 | Thin film deposition | |
| Available | Fume Hood - CBD | PC48 | Wet process & preparation | |
| Available | ALD - F120 | PT15 | Thin film deposition | |
| Available | Sulfoselenisation Furnace (SuSe) | PD20 | Thermal process | |
| Available | Sputter - magnetron ZnO/CZTS | PT16 | Thin film deposition | |
| Available | Laminator | PB15 | Backend process | |
| Available | Image Reversal / Vapor Prime Furnace | PL36 | Lithography | |
| Available | ALD | PT17 | Thin film deposition | |
| Available | SEM/EDS/EBSD - Merlin | AS05 | Scanning electron Microscopy (SEM) | |
| Available | Nanoindenter | AU06 | Surface analysis | |
| Available | Vacuum Leak Tester | PO01 | Other processes | |
| Available | Fume hood – solvents | FC06 | Wet process & preparation | |
| Available | Fume hood – acids | FC09 | Wet process & preparation | |
| Available | EBL (e-beam litho) - NBL | PL37 | Lithography | |
| Available | Resist spinner | PL38 | Lithography | |
| Available | Spectroscopic reflectometer "K-MAC" | PM31 | Metrology | |
| Available | Ion Polisher Ilion | AP34 | Sample preparation | |
| Available | Stylus Profiler "DektakXT" | PM32 | Metrology | |
| Available | Vacuum storage (large) | PO03 | Other processes | |
| Available | Vacuum storage (small) | PO04 | Other processes | |
| Available | ALD - MP3 | PT19 | Thin film deposition | |
| Available | Sputter-RTA platform (BERTHA) | PT20 | Thin film deposition | |
| Available | Resist Laminator | PB16 | Backend process | |
| Available | Wet Bench - solvent cleaning | PL27 | Lithography | |
| Available | SEM/EDS - 1530 | AS06 | Scanning electron Microscopy (SEM) | |
| Available | Diamond polishing | AT17 | Transmission electron microscopy (TEM) | |
| Available | Fume Hood – KCN | PC51 | Wet process & preparation | |
| Available | Glass substrate cleaner | PC52 | Wet process & preparation | |
| Available | TEM/EDS - Titan | AT18 | Transmission electron microscopy (TEM) | |
| Available | ESCA II | AX02 | Chemical analysis | |
| Available | Ion Beam Etcher | PE10 | Dry etch | |
| Available | ALD - inSE | PT21 | Thin film deposition | |
| Available | 3D Optical Profiler ZYGO | AU07 | Surface analysis | |
| Available | Optical microscope | PL39 | Lithography | |
| Available | Ion Beam Etcher | PE11 | Dry etch | |
| Available | Laser cutter | PB17 | Backend process | |
| Available | TCO sputter | PT18 | Thin film deposition | |
| Available | XRF | AX03 | Chemical analysis | |
| Available | GDOES | AX04 | Chemical analysis | |
| Available | Spectroscopic ellipsometer | PM33 | Metrology | |
| Available | PCB plotter | PB18 | Backend process | |
| Available | PL / EL Quantum Yield | PM34 | Metrology | |
| Available | FIB/SEM - Crossbeam | AF02 | Focused ion beam (FIB) | |
| Available | Sputter - table-top | PT22 | Thin film deposition | |
| Available | Four Point Probe | PM35 | Metrology | |
| Available | Plasmastripper "New Lower" | PE12 | Dry etch | |
| Available | LOM - Leica DVM6 - Optical Microscope | AU08 | Surface analysis | |
| Available | Spin-Rinse-Dryer | PC53 | Wet process & preparation | |
| Available | 2-photon writer | PA01 | Additive manufacturing | |
| Available | Sputter - DC / RF | PT23 | Thin film deposition | |
| Available | Ion mill PIPS | AT19 | Transmission electron microscopy (TEM) | |
| Available | Extruder | PA03 | Additive manufacturing | |
| Available | EBL (e-beam litho) - JEOL | PL40 | Lithography | |
| Available | UHV-PVD | PT24 | Thin film deposition | |