| Warning | Wet Bench Etch and strip | PC01 | Wet process & preparation | Bath A, nitride etch, out of order. |
| Warning | Wet Bench (KOH / HF) | PC19 | Wet process & preparation | Circulation pump not working. |
| Warning | RTP | PD15 | Thermal process | No process above 500C is allowed. |
| Warning | ICP-RIE (Si-DRIE) "Tegal" | PE07 | Dry etch | Load lock transfer valve need special trick to be opened. Ask if you don't know that trick! Spare part due Dec 5th |
| Warning | Optical Microscope | PM17 | Metrology | The scale is incorrect (for all objectives). Not possible to do measurments. |
| Warning | Sputter - magnetron "Von Ardenne" | PT01 | Thin film deposition | The switch is manually switched on from the service finger. This cannot be changed from the computer. Recipes in both chambers can be run. However, at the end of each program, it tries to switch off the power switch which will give an error. Just acknowledge the error and click on the flash sign down to the right and select start. Then it is possible to run another recipe. |
| Warning | TEM/EDS - Titan | AT18 | Transmission electron microscopy (TEM) | Vacuum leakage with sample holder inserted, compustage verification requested to Thermofisher.
Regards,
\Olivier |
| Warning | FIB/SEM - Crossbeam | AF02 | Focused ion beam (FIB) | Scan control repaired, SEM working as intended.
Ga source to be replaced (no FIB possible yet)!
Regards,
Olivier |
| Warning | Evaporator - cryo (restricted use) | PT08 | Thin film deposition | Double-check recipes before deposition. Contact Henry if there is a doubt.
|
| Down | Vertical Furnace - LPCVD (TEOS oxide) | PD10 | Thermal process | Pumps on poly-Si PD08.
Vacuum pump oil levels need to be checked before every run. Contact MSL prior to run. |
| Down | SEM/EDS - 1530 | AS06 | Scanning electron Microscopy (SEM) | The equipment is currently down due to failure in the power supply unit.
|
| Down | GDOES | AX04 | Chemical analysis | Down until 2nd of June (needs warm-up after power off). |
| Down | Spin-Spray Coater | PL31 | Lithography | PC problems. |
| Down | Plasmastripper "Upper" | PE04 | Dry etch | Can only be run in manual mode. See instruction at machine. Only as spare, should PE12 die. |
| Available | RIE (SiO / SiN) | PE06 | Dry etch | |
| Available | ICP-RIE (Si-DRIE / aluminum etch) | PE01 | Dry etch | |
| Available | Optical Microscope | PM01 | Metrology | |
| Available | Optical Microscope | PM02 | Metrology | |
| Available | Optical Microscope | PM03 | Metrology | |
| Available | Ellipsometer "Rudolph" | PM12 | Metrology | |
| Available | Wire Bonder - ball | PB19 | Backend process | |
| Available | ESCA II | AX02 | Chemical analysis | |
| Available | Ion Beam Etcher | PE10 | Dry etch | |
| Available | ALD - inSE | PT21 | Thin film deposition | |
| Available | 3D Optical Profiler ZYGO | AU07 | Surface analysis | |
| Available | Optical microscope | PL39 | Lithography | |
| Available | Ion Beam Etcher | PE11 | Dry etch | |
| Available | TCO sputter | PT18 | Thin film deposition | |
| Available | XRF | AX03 | Chemical analysis | |
| Available | IR camera | PM18 | Metrology | |
| Available | Balance | PM19 | Metrology | |
| Available | Balance | PM20 | Metrology | |
| Available | Saw - low speed | AP01 | Sample preparation | |
| Available | Saw | AP02 | Sample preparation | |
| Available | Embedder | AP03 | Sample preparation | |
| Available | Wet Grinder | AP05 | Sample preparation | |
| Available | Polisher | AP06 | Sample preparation | |
| Available | Polisher | AP07 | Sample preparation | |
| Available | Sputter Coater - Au/Pd | AP16 | Sample preparation | |
| Available | Evaporator (C) | AP17 | Sample preparation | |
| Available | Ultrasonic Cleaner | AP28 | Sample preparation | |
| Available | Hot Plate | AP31 | Sample preparation | |
| Available | Balance | AP32 | Sample preparation | |
| Available | LOM - Olympus - Optical Microscope | AU03 | Surface analysis | |
| Available | AFM - PSIA XE150 | AU04 | Surface analysis | |
| Available | SEM/EDS - 1550 | AS02 | Scanning electron Microscopy (SEM) | |
| Available | Ultrasonic Disc Cutter | AT04 | Transmission electron microscopy (TEM) | |
| Available | Polisher | AT05 | Transmission electron microscopy (TEM) | |
| Available | Dimple Grinder | AT07 | Transmission electron microscopy (TEM) | |
| Available | Ion Mill PIPS | AT08 | Transmission electron microscopy (TEM) | |
| Available | Plasma Cleaner | AT09 | Transmission electron microscopy (TEM) | |
| Available | Ultrasonic Cleaner | AT12 | Transmission electron microscopy (TEM) | |
| Available | Hot Plate | AT13 | Transmission electron microscopy (TEM) | |
| Available | Four Point Probe - automatic | PM21 | Metrology | |
| Available | Vertical Furnace (high temp anneal) | PD05 | Thermal process | |
| Available | Dicing Saw | PB01 | Backend process | |
| Available | Wire Bonder - ball | PB02 | Backend process | |
| Available | Wire Bonder - wedge | PB03 | Backend process | |
| Available | Evaporator - TMP (general use) | PT07 | Thin film deposition | |
| Available | Spectroscopic ellipsometer | PM33 | Metrology | |
| Available | PCB plotter | PB18 | Backend process | |
| Available | PL / EL Quantum Yield | PM34 | Metrology | |
| Available | Diamond polishing | AT17 | Transmission electron microscopy (TEM) | |
| Available | Fume Hood – KCN | PC51 | Wet process & preparation | |
| Available | Glass substrate cleaner | PC52 | Wet process & preparation | |
| Available | Plating Station - pulse (Cu) | PC42 | Wet process & preparation | |
| Available | Stylus Profiler "Dektak 150" | PM22 | Metrology | |
| Available | Sputter - table-top | PT22 | Thin film deposition | |
| Available | Four Point Probe | PM35 | Metrology | |
| Available | Plasmastripper "New Lower" | PE12 | Dry etch | |
| Available | LOM - Leica DVM6 - Optical Microscope | AU08 | Surface analysis | |
| Available | Spin-Rinse-Dryer | PC53 | Wet process & preparation | |
| Available | 2-photon printer | PA01 | Additive manufacturing | |
| Available | Sputter - DC / RF | PT23 | Thin film deposition | |
| Available | Ion mill PIPS | AT19 | Transmission electron microscopy (TEM) | |
| Available | Extruder | PA03 | Additive manufacturing | |
| Available | EBL (e-beam litho) - JEOL | PL40 | Lithography | |
| Available | UHV-MET | PT24A | Thin film deposition | |
| Available | Beamer computer | PL41 | Lithography | |
| Available | Multi-capabilities 3D printer | PA02 | Additive manufacturing | |
| Available | UHV-OXY | PT24B | Thin film deposition | |
| Available | UHV-PLD | PT24C | Thin film deposition | |
| Available | XRD | PM36 | Metrology | |
| Available | Pick-&-Place (w. dispenser) | PB06 | Backend process | |
| Available | Screen Printer | PB07 | Backend process | |
| Available | Hydraulic Press (w. heater) | PB08 | Backend process | |
| Available | Solder Furnace | PB09 | Backend process | |
| Available | Resist Laminator | PB10 | Backend process | |
| Available | UV Exposure | PB11 | Backend process | |
| Available | Resist Furnace | PB12 | Backend process | |
| Available | Dip Coater | PC44 | Wet process & preparation | |
| Available | Spray Etcher | PC45 | Wet process & preparation | |
| Available | Parylene Coater | PD16 | Thermal process | |
| Available | HT Furnace - atm | PD17 | Thermal process | |
| Available | Plasma Etcher | PE08 | Dry etch | |
| Available | Measuring Microscope with Digital Readout | PM24 | Metrology | |
| Available | Stereo Microscope | PM25 | Metrology | |
| Available | X-Ray Inspection Station | PM26 | Metrology | |
| Available | Resist Furnace (90 C) | PL15 | Lithography | |
| Available | Optical Microscope | PL35 | Metrology | |
| Available | Ultrasonic Cleaner | AP33 | Sample preparation | |
| Available | Furnace | AT15 | Transmission electron microscopy (TEM) | |
| Available | Polisher | AT16 | Transmission electron microscopy (TEM) | |
| Available | Sputter - magnetron "Lesker" | PT09 | Thin film deposition | |
| Available | CIGS evaporator - BAK | PT10 | Thin film deposition | |
| Available | Evaporator - UMS | PT11 | Thin film deposition | |
| Available | Spin-Rinse-Dryer | PC47 | Wet process & preparation | |
| Available | Mo sputter - MRC II | PT13 | Thin film deposition | |
| Available | Scriber | PB14 | Backend process | |
| Available | E-beam/resisitive evaporator - BA | PT14 | Thin film deposition | |
| Available | Fume Hood - CBD | PC48 | Wet process & preparation | |
| Available | ALD - F120 | PT15 | Thin film deposition | |
| Available | Sulfoselenisation Furnace (SuSe) | PD20 | Thermal process | |
| Available | Sputter - magnetron ZnO/CZTS | PT16 | Thin film deposition | |
| Available | Laminator | PB15 | Backend process | |
| Available | Image Reversal / Vapor Prime Furnace | PL36 | Lithography | |
| Available | ALD | PT17 | Thin film deposition | |
| Available | SEM/EDS/EBSD - Merlin | AS05 | Scanning electron Microscopy (SEM) | |
| Available | Nanoindenter | AU06 | Surface analysis | |
| Available | Vacuum Leak Tester | PO01 | Other processes | |
| Available | Fume hood – solvents | FC06 | Wet process & preparation | |
| Available | Fume hood – acids | FC09 | Wet process & preparation | |
| Available | EBL (e-beam litho) - NBL | PL37 | Lithography | |
| Available | Resist spinner | PL38 | Lithography | |
| Available | Spectroscopic reflectometer "K-MAC" | PM31 | Metrology | |
| Available | Ion Polisher Ilion | AP34 | Sample preparation | |
| Available | Stylus Profiler "DektakXT" | PM32 | Metrology | |
| Available | Vacuum storage (large) | PO03 | Other processes | |
| Available | Vacuum storage (small) | PO04 | Other processes | |
| Available | ALD - MP3 | PT19 | Thin film deposition | |
| Available | Sputter-RTA platform (BERTHA) | PT20 | Thin film deposition | |
| Available | Resist Laminator | PB16 | Backend process | |
| Available | Wet Bench - solvent cleaning | PL27 | Lithography | |
| Available | Mask Aligner - front / back side align | PL03 | Lithography | |
| Available | Spin Coater | PL08 | Lithography | |
| Available | Spin Coater | PL10 | Lithography | |
| Available | Hot Plate | PL11 | Lithography | |
| Available | Hot Plate | PL12 | Lithography | |
| Available | Hot Plate | PL13 | Lithography | |
| Available | Vac. / Vap. Prime Furnace | PL14 | Lithography | |
| Available | Resist Furnace | PL18 | Lithography | |
| Available | Wet Bench / E-beam resist spinner | PL20 | Lithography | |
| Available | Wet Bench / E-beam resist hot-plate | PL21 | Lithography | |
| Available | Wet Bench / E-beam resist development | PL22 | Lithography | |
| Available | Wet Bench - acid | PL23 | Lithography | |
| Available | Wet Bench - acid | PL24 | Lithography | |
| Available | Wet Bench - work desk | PL25 | Lithography | |
| Available | Wet Bench - Water rinse | PL26 | Lithography | |
| Available | Resist Furnace (110 C) | PL16 | Lithography | |
| Available | Nanoimprinter | PL30 | Lithography | |
| Available | Wet Bench (KOH-IPA / HF / warm rinse) | PC20 | Wet process & preparation | |
| Available | Wet Bench - acid drain, spin dryer | PC22 | Wet process & preparation | |
| Available | Vertical Furnace (oxidation) | PD01 | Thermal process | |
| Available | Vertical Furnace (oxidation) | PD02 | Thermal process | |
| Available | Vertical Furnace (general purpose) | PD03 | Thermal process | |
| Available | Vertical Furnace (metal anneal) | PD07 | Thermal process | |
| Available | Vertical Furnace - LPCVD (poly-Si, a-Si) | PD08 | Thermal process | |
| Available | Vertical Furnace - LPCVD (Si3N4, SiNx) | PD09 | Thermal process | |
| Available | Wet Bench Acid surface treatments | PC02 | Wet process & preparation | |
| Available | Wet Bench (RCA1 / RCA2 / HF) | PC03 | Wet process & preparation | |
| Available | Wet Bench (RCA1 / RCA2 / HF) | PC04 | Wet process & preparation | |
| Available | Wet Bench Solvent clean | PC05 | Wet process & preparation | |
| Available | Wet Bench Resist lift-off | PC06 | Wet process & preparation | |
| Available | Wet Bench Oxide etching | PC07 | Wet process & preparation | |
| Available | Wet Bench Piranha | PC08 | Wet process & preparation | |
| Available | Wet Bench Metal etching | PC09 | Wet process & preparation | |
| Available | Wet Bench - Megasonic cleaning | PC10 | Wet process & preparation | |
| Available | Wet Bench - Ultrasonic cleaning | PC11 | Wet process & preparation | |
| Available | PC12 - wet bench - Stangl | PC12 | Wet process & preparation | |
| Available | Wet Bench - free acid / acid drain (KOH) | PC18 | Wet process & preparation | |