Basic Information / Capabilities

The EVG101 Advanced Spray Coating System is a System for photoresist coating of wafers up to 8“ / 200mm in diameter. Limited use for coating of smaller substrates using a special chuck is possible, please contact MyFab staff for more detailed instructions. Spray coating atomizes the fluid (photoresist) into a mist, making it ideal for large-area, high-aspect-ratio, and non-planar geometries.

Technical Specification

• • Recipe-controlled resist dispensing process
• • Pressure-less ultrasonic atomization of the resist material guarantees precisely controlled droplet size independent to N₂ flow
• • Narrow spectral droplet distribution
• • Range of photoresists with viscosities up to 52000 cP
• • Conformal coating of 300µm deep patterns with aspect ratios up to 1:10 and vertical sidewalls
• • Heated chuck up to 80^oC 
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Performance

Photoresist mixtures provided by MyFab:

• AZ10XT (for 6um thickness)
• AZ10XT (for 12um thickness)

Restrictions

        • Chips / small pieces require special mounting and approval

        • Non-standard photoresists and other mixtures require approval from MyFab staff

Chemistry / Materials

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