Basic Information / Capabilities

HP8BM - bench mounted hot plate for soft/hard baking of wafers from 2"up to 6" or substrates from 5 x 5 mm up to 150 x 150 mm

Technical Specification

            • temperature range (60-250 ^oC)

            • uniformity +-0,5 ^oC up to 120 ^oC

            • max recipies 200

            • max recipe steps 40

            • programable temperature ramps 0-10 ^oC/min for heating

            • step time 0 - 999 s in 1 s steps

Performance

-

Restrictions

         • Su8 baking not alowed

        • PDMS baking not alowed

        • Baking of non-standard (epoxy based) photoresists require approval from MyFab staff.

Chemistry / Materials

Standard photoresists provided by MyFab:

         • S1813

         • AZ10XT

         • Su8-50