Basic Information / Capabilities

SUUS LABSPIN6 BM - bench mounted spinning system for wafers up to 150 mm round and up tp 100 mm squere substrates.

Technical Specification

- speed 50 - 99 rpm, 100 - 8 000 (+-1 rpm) with 150 mm chuck

- acceleration 4 000 rpm/sec

- spinning time 1 s up to 999 s

- max 200 recipes

-max 40 steps in recipe

- vacuum chucks for 2", 3", 4", 6" wafers and square substrates from 5 to 100 mm

Aditional functions:

- automatic dispense

- edge bead removal

- center and edge coating

FULL AUTOMATIC DISPENCE SYSTEM 20ML - capable to dispence small quantities of photoresist without filtration:

- dispense volume 0.1 - 20 ml programmable in mini controler with touch panel

- dispense accuracy less 1%

- dispense speed programmable in 10 steps

- recomended for viscosities from 1cP to 500cP

EDGE BEAD REMOVAL - adjustable EBR stainless steel needle for cleaning wafer edge with solvent:

- adjustable needle position for cleaning edge of 2" to 6" wafer

- inclodes a full automatic dispense system

dispense volume 0.1 - 20 ml programable in mini controler with touch panel

- dispence accuracy less 1%

- dispense speed programable in 10 steps

Performance

-

'Restrictions

        • Su8 spinning not alowed

        • PDMS spinning not alowed

        • Non-standard photoresists require approval from MyFab staff.

Chemistry / Materials

Standard photoresists provided by MyFab:

         • S1813

         • AZ10XT

         • Su8-50