Picture of Mask Aligner - front / back side align
Current status:
AVAILABLE
Book | Log
Show/Collapse all

1st Responsible:
2nd Responsible:
You must be logged in to view files.

Basic Information / Capabilities

The Karl-Suss MA6/BA6 system is a dual-use mask and wafer-bond aligner used for contact exposure processes. Lithography can be performed on wafers from 2” to 4” in diameter using 3”, 4”, 5”, and 7” photomasks incloading back side alignment. Limited use of smaller substrates without backside alignment may be possible using a special 2" chuck, please contact MyFab staff for more detailed instructions.

Technical Specification

Exposure

  • Light source: 350 W super high pressure Mercury short-arc lamp (USH-350DS)
  • Standard broadband exposuer intensity 12 mW/cm2 calibrated for h-line (406 nm)
  • i-line exposuer (365 nm) calibrated for 4 mW/cm2 available on request
  • Intensity Uniformity: ±5%
  • Gap Setting Accuracy: 1 μm

Alignment Accuracy:

  • Top Alignment: ± 0.5 μm
  • Backside Alignment: ± 1 μm
  • Bond Alignment: ± 0.5 μm

Alignment Stage

  • X travel: ±5 mm
  • Y travel: ±5 mm
  • Theta range: ±5°
  • Mechanical alignment stage accuracy: 0.1 μm (step size)

TSA Microscope Stage:

  • X: ±25 mm
  • Y: ±15/-75 mm
  • Theta: ±3°
  • Split Field objective Separation: 32-160 mm

BSA Splitfield Microscope:

  • Objective Separation: 15-100 mm
  • Movement Range: Y:+50/-20 mm
  • Field of View: 0.92 x 0.69 mm2

 

Performance

Maximum Resolution, by contact type

  • Soft contact: <2.5 μm
  • Hard contact: <1.0 μm
  • Vacuum contact: <0.8 μm

Restrictions

        • Chips / small pieces require special mounting and approval.

        • Non-standard photoresists, materials or processes require approval from MyFab staff.

        • Wafer-bond alignement require special stage mounting and approval (contact MyFab staff for more detailed          instructions).

Chemistry / Materials

Standard photoresists provided by MyFab:

         • S1813

         • AZ10XT

         • Su8-50

Safety

         • UV Exposure: The high energy light produced by the high pressure Mercury  lamp can cause eye damage and skin burns. Do not look directly at the mask during exposure.

         • Ozone: The high-pressure lamp produces ozone, which can result in pneumonia-like symptoms. The effects are cumulative. The lamp may only be “on” when the air flow is “on”.

         • Lamp Explosion: If you suspect that the UV Lamp has exploded, evacuate the room immediately and notify MyFab Staff.

         • Moving Components – The User should be aware at all times of the moving components associated with this tool. For instance, the topside microscope assembly moves up and down, and does present a potential hazard. The User must exert caution at all times such that a limb, finger, or article of clothing does not become trapped or entangled (or worse, violently detached) when components of the machine are in motion.

Tool name:
Mask Aligner - front / back side align
Area/room:
3R81 - litografi
Category:
Lithography
Manufacturer:
Karl Süss
Model:
MA6 / BA6

Instructors

Licensed Users

You must be logged in to view tool modes.