DAD3221 Automatic Dicing Saw

The DAD3221 by Disco is a compact automatic dicing saw designed for precision dicing of wafers and substrates. It is optimized for small workpieces up to 6 inches and combines high accuracy with automated alignment and inspection features.

The DAD3221 uses a high-speed rotating diamond blade to dice wafers and substrates mounted on a chuck system. Automated alignment, autofocus, and kerf inspection functions assist the user in achieving accurate and repeatable cuts.

Materials:

Silicon
Glass
Alumina
Sapphire
Silicon carbide
Other brittle materials (with appropriate blade selection)

Chucks:

Porous chuck (samples mounted on UV dicing tape)
Vacuum chuck

Capabilities:

Automatic alignment
Autofocus
Automatic kerf inspection
Programmable X-Y cutting patterns
Wafer mapping and process monitoring
Optional Non-Contact Setup (NCS) for rapid blade height measurement

Specifications:

Max. wafer size: up to 6-inch (150 mm)
Maximum workpiece size: 150 mm × 150 mm
Cutting speed: 0.1 – 800 mm/s
Spindle power: 2.0 kW
Spindle speed: 3.000 – 40.000 rpm
Y-axis index step: 0.1 µm
Positioning accuracy: ±5 µm over 160 mm