This tool is a part of UHV PVD system sharing a common sample loading, transfer, storage chambers and dedicated for DC sputtering of metals.
Main technical parameters:
-Base pressure > 10-10 mbar (after breakout)
-Process gas - (Ar)
-3 magnetrons (max DC power 400 W) with the possibility to change the geometry
-Target size 2”, thickness for magnetic targets (1 mm for Fe, 2-3 mm for Co, 2 mm for Ni) and 1-6 mm for nonmagnetic)
-Substrate size up to 2”
-DC bias (1-500 V)
-Substrate temperature (20 - 1000oC)
-Quartz crystal microbalance
-Residual gas analyzer