PT22 - Table-top sputter

Basic Information / Capabilities

The Q300TD plus is a table-top sputter from Quorum that is capable of sputter deposit metallic films up to 4 inch wafers.

It has two targets which enables sequential sputtering without breaking the vacuum.

Substrate can be rotated during deposition.

Technical Specification

Standard target materials provided by Myfab-U:  Au, Cr, Cu, Pt, Al and Ti. Requests for other target materials must be discussed with and approved by lab staff.

Process Specification

A QCM measures the deposition rate and film thickness during sputtering, allowing the process to be stopped once a specified deposition time or film thickness is reached

Standard recipes are available to sputter all available target materials.

Restrictions

Use of any new material, for which a target is not available from MSL, must be discussed with and approved by MSL.