Magnetron sputtering system dedicated to transparent conducting oxides. ITO, ZnO and ZnO:Al targets installed.
Automatic processes for ITO, AZO, and ZnO are available. Up to 4 wafers can be deposited in a single batch. See process details for recommended conditions.
Substrates: Substrate carriers 100mm in diameter, substrate diameter max 98 mm, max. 3 mm thick.
100mm Si wafers can be used without the carrier, other samples on the carrier.