Technical description
Full equipment name: Scientific Vacuum Systems i6000 Milling System Ion Beam Etcher (IBE)
General purpose:
• Etching of any vacuum compatible material through argon ion sputtering and erosion.

Technical data and restrictions:
• IBE tool configured for precise albeit slow etching applications
• Standard wafer size: from chip and pieces up to 150 mm.

• Process capabilities:

• Multiple process recipes for etching
  • Etch rates depend on ion energy and current in combination with etched materials’ sputter yield.
  • Available recipes:
    • MSL fast (etch rate examples: )
    • MSL slow (etch rate examples: Ag 58 nm/min, HfO₂ 8,7 nm/min)

• Selectivity:

• Generally following differences in sputter yield

• Process gases:

• Ar, N₂