Basic Information / Capabilities

Ilion is a compact dual-beam system engineered to produce high-quality cross-section SEM specimens.In addition to cross-section preparation, it can also be used for planar polishing.

Technical specification

• Factory calibrated Ion gas flow ( Ar⁺) for optimum gas flow.

• Duel  beam system with independently controlled ion guns and a speciman mount to load and unload samples without venting the main chamber.

• Possibility to cool sample with LN2.

• Touch screen interface to controll the operation.

• Digital Zoom Microscope software and a digital camera allows for in-situ observation of the sample and to take images.

• Acceleration voltage: 0.1 to 8 kV.

• Beam incidence: Shallow-angle milling for cross-sectioning and normal-incidence for planar polishing.

• Ion-Beam modulation: Cross section (Single modulation), Planar, Dual modulation, stationary right and stationary left.

Performance

• Precision Milling (Argon Ion Beam): Utilizes two Penning Ion Guns (PIGs) to produce a high-energy argon ion beam that removes material at the atomic level, eliminating mechanical artifacts like smearing, scratches, or embedded abrasives.

• Low-Voltage Final Polish: Capable of operating at very low energies (down to 100 eV), which is critical for the final polishing of delicate materials to minimize amorphous layer thickness and ion-induced heat damage.

• High Milling Rates: At maximum energy (up to 8.0 keV), the system provides rapid material removal for hard materials like ceramics, semiconductors, and composites, significantly reducing sample preparation time.

• Sample Protection (Cooling): Features an optional Liquid Nitrogen (LN2) cooling stage. This is vital for the performance on polymers, solder, or low-melting-point metals, preventing structural changes or melting during the milling process.

• Real-Time Monitoring: Includes a high-resolution digital microscope that allows for in-situ monitoring of the milling process, ensuring the user can stop exactly when the desired cross-section or surface quality is reached.

Restrictions

• Material Compatibility: As an argon-based polisher, it is not suitable for materials that react strongly with noble gases. Highly porous materials can also be challenging to polish, as the ion beam may penetrate cavities unevenly, creating "pitting."

• Heat Sensitivity: Without the LN2 cooling option, ion bombardment can generate enough heat to melt or alter the chemical structure of polymers, solder, and other low-melting-point materials.

• Artifacts (Curtaining): If the sample is heterogeneous (consisting of materials with significantly different hardness levels), an effect called "curtaining" may occur, where the beam removes material in vertical streaks. This requires careful optimization of angles and rotation.

• Pre-Processing Requirements: The system is designed for final finishing or precision cross-sectioning. It is not a replacement for coarse mechanical cutting; samples must be relatively flat and clean before being loaded.