Basic Information / Capabilities
The NanoBeam Ltd. nB5 electron beam lithography (EBL) system is used for electron-beam patterning on chips and wafers. The tool supports multiple substrate chuck types and can load up to six chucks for sequential exposure jobs. Pattern data are prepared from standard CAD formats and executed via text-based job instruction files. Pattern resolution: 40 nm.
Technical Specification
Process Specification
EBL exposure (std operation)
Acceleration voltage: 80 kV
Beam current range: 1–15 nA (depending on resolution/throughput requirements)
Pattern data / job preparation:
• CAD import and conversion: DXF, GDSII → npf (machine format)
• Exposure jobs defined via text-based job instruction file (special syntax)
Throughput / stitching / overlay:
(typically depends on pattern density, beam current, field size, and write strategy)
Restrictions
• Substrate / sample size: chips and pieces up to 200 mm wafers.
• Approved chucks: arbitrary-shaped substrate chuck, 200 mm wafer chuck, 150 mm wafer chuck, 100 mm wafer chuck, and 20×20 mm / 10×10 mm chip chucks.
• Maximum sequential loading: up to 6 chucks per load for sequential writing.
• Non-standard substrates, unusual topography, or special mounting approaches may require approval from lab staff.
Chemistry / Materials
Not applicable (vacuum electron-beam patterning tool; no process gases).
Service / Consumables
Service utensils can be found in cupboard CB58, service finger 3R85.