Basic Information / Capabilities

The YES-58TA-E is a dual prosess system for image reversal or vapour priming using Ammonia or HMDS.

             • Image reversal – a bake in Ammonia (NH₃) environment cross-links the exposed areas: the exposed area becomes insensitive, while unexposed area remains photoactive. This process provides high resolution negative images from positive photoresist with negative sidewall profile for lift off processes. 

             • HMDS (hexamethyldisilazane) treatment is a crucial lithography step that modifies wafer surfaces from hydrophilic to hydrophobic. By binding a trimethylsilyl monolayer to the surface, it dramatically improves photoresist adhesion and prevents pattern delamination or undercutting during subsequent developing processes.

Technical Specification

          • Up to 150 +/- 1 °C (typically 90 °C for image reversal and 150 °C for vapour prime).

          • Capacity of 10 cassettes of 100 mm wafers or 8 cassettes of 125mm or 150mm wafers. The inner shelf can be removed for use of 2 cassettes op to 300mm wafers.

Performance

         • The duration of the entire process is 120 min for Image reversal and 16 min for HMDS prime.

Restrictions

        • Only clean wafers, chips / small pieces are allowed.

        Chemistry / Materials

         • Ammonia (NH₃)

         • HMDS

Safety

         • be aware that temperature of 150^oC can cause a finger burn while taking casete out, use protective gloves.

         • Ammonia (NH3) is a highly pungent, colorless compound made of nitrogen and hydrogen. High concentrations are highly corrosive, irritating, and toxic.

         • HMDS is highly flammable and sensitive to moisture. Upon contact with water, it hydrolyzes to form ammonia and hexamethyldisiloxane. It is toxic in contact with skin and harmful if swallowed or inhaled.