The RLM 419P is a precision dry film laminator designed for applying photoresist films onto substrates such as printed circuit boards (PCBs), metal sheets, and other flat materials. It ensures uniform lamination essential for photolithography and etching processes.

Applications (examples):
- PCB prototyping and manufacturing
- Solder mask application
- Wafer masking
- SMT stencil production
- Metal working and mold etching

Compatible materials:
- All commercial dry film resists with 3" and 5" core diameters
- Substrates ranging from 0,3 mm to 5 mm in thickness
- Board sizes from 50 × 50 mm up to 450 mm (length unlimited)

Key Features & Benefits:
- Electrically heated rollers with uniform temperature distribution (20 -120 °C)
- Adjustable pressure and speed for optimal lamination control (0,2 -1,2 m/min)
- Infrared temperature sensors for precise thermal regulation
- Wrinkle-free lamination via separate transport and heating rollers
- Quick setup with easy mounting of resist rolls and detachable inlet table
- Compact and robust design