The DAD361 by Disco is a semi-automatic dicing saw designed for precision cutting of wafers and substrates. It is widely used for semiconductor and microfabrication processes, offering reliable performance for small to medium wafer sizes.

Function:
The DAD361 uses a high-speed rotating blade to dice wafers mounted on a chuck system. It supports manual alignment for accurate die separation.

Materials:
- Silicon wafers (primary use)
- Glass and quartz
- Ceramics
- Other brittle materials (with appropriate blade)

Chucks:
- Porous chuck: for samples up to 4 inches, requires UV tape for mounting
- Vacuum chuck: for samples up to 6 inches, UV tape not required

Capabilities:
- Manual or semi-automatic alignment
- Programmable X-Y cutting dimensions
- Kerf inspection via integrated microscope
- Compatible with UV tape for easy die removal (when using porous chuck)

Specifications:
- Max. wafer size: up to 6-inch (150 mm)
- Cutting range: approx. 150 mm × 150 mm
- Spindle speed: up to 30.000 rpm
- Cutting speed: ~1 - 50 mm/s (material dependent)
- Accuracy: ± 5 µm