PT24C - UHV-PLD
Basic Information / Capabilities
This tool is a part of UHV PVD system sharing a common sample loading, transfer, storage chambers and dedicated for Pulsed Laser Deposition of composite materials. The chamber is equipped with six target allowing for deposition of thin films/multilayered structures.
Technical Specification
-Base pressure > 10-10 mbar (after breakout)
-Process gas - (Ar, O2)
-COMPex 205 Laser (248 nm, max 750 mJ, max 33 W (attenuator controlled), 1-50 Hz)
-Revolver for 6 targets op to 2”, thickness up to 6 mm)
-Substrate size up to 2”
-Substrate temperature (20 - 1000oC)
-Quartz crystal microbalance
-Residual gas analyzer
Restrictions
Only UHV compatible substrates are allowed.