Basic Information / Capabilities
Magnetron sputtering deposition system CS730S (Von Ardenne) dedicated to transparent conducting oxides. Sputtering is performed with a RF (radio frequency) or a DC (direct current) in an Ar atmosphere with addition of O2.
The machine consists of a process chambers (PC1) equipped with three magnetron sources, one load chamber (LC) and one transfer chamber (TC).
Process Specification
ITO, ZnO and ZnO:Al targets installed.
Automatic processes for ITO, AZO, and ZnO are available. Up to 4 wafers can be deposited in a single batch. See process details for recommended deposition conditions.
Restrictions and Substrates:
- Substrate carriers for substrates up to 150 mm in diameter, max. 3 mm thick.
- Heating of the substrates occurs during the deposition. Consult the use of temperature sensitive substrates with the tool responsible.