PT17 - ALD

Basic Information / Capabilities

This ALD (Atomic Layer Deposition) tool comprises a Picosun R200 ALD system. 

Technical Specification

Available materials for deposition: Al₂O₃ (temporally out of service), TiO₂, Ta₂O₅, SiO₂ (out of senvice). For other materials check PT21.

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Possible to control film thickness at sub-nm level.

Options for plasma and ozone processing. Substrate temperature up to 500 °C.

Polymers and photoresist allowed only for deposition at low temperatures (<100 °C).