Main features: Automatic/Manual measurement range selection; Remote control by operating software; Auto contact system; Auto range selection; Full remote control; Data Analysis software under Windows environment. Specification 1. Sheet resistance Measuring method: Contact by 4-point probe, Measuring range: 1 mohm/sq - 2 Mohm/sq. 2. Resistivity Measuring method: Contact by 4-point probe (Input thickness), Measuring range: 10.0 µohm•cm - 200.0 Kohm•cm. 3. Measurement accuracy ±0.5% (VLSI Standard wafer, when 23°C. 4. Specimen (Wafer) max 8"; Rectangular (140mm x 140mm). 5. Measuring time Approx. 4 sec/point.